(China (Mainland))
Product Summary
The EPF10K100GC5033 device is the first embedded PLD. Based on reconfigurable CMOS SRAM element, the Flexible Logic Element MatriX (FLEX) architecture incorporates all features necessary to implement common gate array megafunctions. With up to 250,000 gates, the FLEX 10K family provides the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Parametrics
EPF10K100GC5033 absolute maximum ratings: (1)Supply voltage:–2.0 to 7.0 V; (2)DC input voltage: –2.0 to 7.0 V; (3)DC output current, per pin:–25 to 25 mA; (4)Storage temperature :–65 to 150 ° C; (5)Ambient temperature: –65 to 135 ° C; (6)Junction temperature:Ceramic packages, under bias:150 ° C;PQFP, TQFP, RQFP, and BGA packages, under bias:135 ° C.
Features
EPF10K100GC5033 features: (1)The first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration; (2)High density; (3)System-level features:MultiVolt I/O interface support; 5.0-V tolerant input pins in FLEX 10KA devices;Low power consumption (typical specification less than 0.5 mA ; (8)in standby mode for most devices); FLEX 10K and FLEX 10KA devices support peripheral component interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2; FLEX 10KA devices include pull-up clamping diode, selectable on a pin-by-pin basis for 3.3-V PCI compliance; Select FLEX 10KA devices support 5.0-V PCI buses with eight or fewer loads; Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming any device logic.
Diagrams
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 EPF10K100ABC356-2 |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-2N |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-3 |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABI600-2 |
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IC FLEX 10KA FPGA 100K 600-BGA |
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EPF10K100ARC240-1 |
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IC FLEX 10KA FPGA 100K 240-RQFP |
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EPF10K100ARC240-1N |
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IC FLEX 10KA FPGA 100K 240-RQFP |
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